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Thermal management Bibiri Circuit Board (PCB) -SinkPAD TM
SinkPAD bụa thermal management Printed Circuit Board (PCB) technologynke ahụ na-eme ka o kwe omume iduzi okpomọkụ site na LED na n'ime ikuku ngwa ngwa na nke ọma karịa MCPCB nkịtị.SinkPAD na-enye arụmọrụ okpomọkụ dị elu maka ọkụ ọkụ ọkụ dị elu ruo elu.
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Aluminom isi dị ọnụ ala laminated ọla kọpa foil SinkPAD PCB
Kedu ihe bụ Thermoelectric Separation Substrate?The sekit n'ígwé na thermal pad na mkpụrụ na-kewapụrụ, na thermal isi nke thermal components na-akpọtụrụ ndị na-eduzi okpomọkụ ozugbo iji nweta mmetụta kachasị mma nke thermal conductive (zero thermal resistance).Ihe nke ihe eji eme ihe bụ n'ozuzu metal (ọla kọpa) substrate. -
Direct thermal ụzọ MCPCB na Sink-pad MCPCB, Copper Core PCB, Copper PCB
Nkọwa ngwaahịa Isi ihe: Alu/ ọla kọpa ọkpụrụkpụ: 0.5/1/2/3/4 OZ osisi ọkpụrụkpụ:0.6-5mm Min.Dayameta oghere: T/2mm Min.Ogologo ahịrị:0.15mm Min.Line spacing: 0.15mm Elu imecha: HASL, ọla edo imi, ọla edo na-egbuke egbuke, ọla edo edo edo, aha ihe OSP: MPCCB LED PCB Printed bọọdụ sekit, Aluminom PCB, ọla kọpa isi PCB V-cut Angle: 30°,45°,60° Ọdịdị ndidi: +/- 0.1mm oghere DIA ndidi: +/- 0.1mm Thermal Conductivity: 0.8-3 W / MK E-ule voltaji: 50-250V Peel-apụ ike: 2.2N / mm Warp ma ọ bụ ighikota:
