Low-cost Aluminum core laminated copper foil SinkPAD PCB Featured Image

Aluminom isi dị ọnụ ala laminated ọla kọpa foil SinkPAD PCB

Kedu ihe bụ Thermoelectric Separation Substrate?

The sekit n'ígwé na thermal pad na mkpụrụ na-kewapụrụ, na thermal isi nke thermal components na-akpọtụrụ ndị na-eduzi okpomọkụ ozugbo iji nweta mmetụta kachasị mma nke thermal conductive (zero thermal resistance).Ihe nke ihe eji eme ihe bụ n'ozuzu metal (ọla kọpa) substrate.

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PCB nkọwa

Ụdị PCB	SinkPAD II teknụzụ
Nha PCB	50.0 × 60.0mm
Ụdị	bọọdụ okirikiri
Ụdị Metal isi	Aluminom
Mechaa Ọkpụrụkpụ	0.062 sentimita (1.57 mm)
Ụzọ ọkụ ozugbo	EE
Nrụpụta okpomọkụ	240.0 W/mK
Emecha elu elu	LF HASL
Okpomọkụ Transition Glass.	170 Celsius
UL kwadoro	Ee
Nkwekọrịta RoHS	Ee