Hot ire HDI Multilayer FR4 PCB bọọdụ sekit Maka Micro SD kaadị
Nkọwa ngwa ngwa:
Ọla kọpa: 1 oz
Ọkpụrụkpụ osisi: 1.0mm
Min.Ogo oghere: 0.20mm
Min.Ogologo ahịrị: 0.075mm
Min.Ogologo ahịrị: 0.075mm
Ngwucha elu ala:ENIG
Nha bọọdụ: ahaziri
Agba nkpuchi ihe nkpuchi: Green ink
Nkwenye ịdị arọ bọọdụ:+/- 10%
V-egbutu akụkụ:25°,30°,45°,60°
Tụgharịa & Kechie: ≤ 0.5%
Faịlụ:Pro tel 99se/P-CAD/Auto cad/Cam350
Nkwakọ ngwaahịa dị n'ime: Mkpokọta Vacuum, Akpa plastic
Nkwakọ ngwaahịa dị n'èzí: nkwakọ ngwaahịa katọn ọkọlọtọ
Ọrụ: PCB & PCBA
oyi akwa:6 oyi akwa
Ihe mkpuchi silk: ọcha
Nkọwa ngwaahịa
1 | Nkọwa | Nkọwa PCB |
2 | Ihe onwunwe | FR-4/HTG150-180 FR-4/CEM-1/CEM-3/Aluminom |
3 | oyi akwa | 1-20 |
4 | Ọkpụrụkpụ osisi | 0.2mm-4.0mm |
5 | Nkwadebe ịdị arọ nke bọọdụ | +/- 10% |
6 | Ọkpụkpụ ọla kọpa | 17.5um-175um (0.5oz-5oz) |
7 | Obosara Min Chọpụta | 0.15mm |
8 | Obosara Obere Oghere | 0.15mm |
9 | Min Drilling Dia | 0.2mm |
10 | PTH ọla kọpa ọkpụrụkpụ | 0.4-2mil (10-50um) |
11 | Nkwenye nke Etching | ±1mil(±25um) |
12 | V-ịkpụ akụkụ | 25°,30°,45°,60° |
13 | Pearl Ike nke ahịrị | ≥ 6lb / n'ime (≥ 107g/mm) |
14 | Njikwa mgbochi na ndidi | 50Ω±10% |
15 | Tụgharịa & Kechie | 0.5% |
16 | Ihe mkpuchi solder | Green, Red, Blue, White, Black, Yellow |
17 | Ngwucha elu/ịkwado elu | HASL/Lead efu HASL/OSP/Gold Plating/Immersion Gold/ENIG |
18 | Asambodo | ROSH.ISO9001 |
19 | Faịlụ | Protel 99se/P-CAD/ Auto cad/Cam350 |
20 | Nkwakọ ngwaahịa dị n'ime | Mkpokọta oghere, akpa rọba |
21 | Nkwakọ ngwaahịa dị n'èzí | Ọkọlọtọ katọn mbukota |
Ụlọ ọrụ anyị:
Dee ozi gị ebe a ziga anyị ya